8308 Underfill Epoxy Adhesive

8308

Overview

8308 Underfill Epoxy Adhesive

is specifically designed for chip and BGA (Ball Grid Array) packaging. Featuring ultra-low viscosity, it quickly flows into microscopic gaps for precision underfill applications. Highly compatible with lead-free solder, it cures to deliver excellent electrical insulation and high hardness, significantly enhancing thermal cycling durability and mechanical strength of electronic components. Ideal for high-density packaging and modern electronics manufacturing, it offers reliable protection for semiconductors and communication modules.

Features

Color: Black
Viscosity: 320 mPa·s
Density: 1.15 g/cm³
Hardness: 90D Shore
Glass Transition Temperature (Tg): 113°C
Coefficient of Thermal Expansion (CTE) Before Tg: 171 K⁻¹
Coefficient of Thermal Expansion (CTE) After Tg: 55 K⁻¹

Product Overview

Product No.	Color	Viscosity mPa·s	Density g/cm³	Hardness Shore	Glass Transition Temp °C	Thermal Expansion Coefficient K⁻¹ Before Tg	Thermal Expansion Coefficient K⁻¹ After Tg
8308	Black	320	1.15	90D	113	171	55
8313	Black	2000	1.55	86D	120	15	70

Features

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Specifications

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