Commonly used in inner film, PVC , XLPE wire, and with good adhesion, and other engineering plastics can be re-injectable.
Instead of potting, using Low-Pressure Molding to cover PCBA and wire harness is more efficient because LPM doesn't request lot of space for curing.
Covering PCBA, antenna. Meets IP68. Can check components through translucent material.
IP67 Passed, Heat Resistance, Strengthen the shock and drop resistance of parts.
Related Products：Low pressure molding Hot Melt Adhesive