3521 Low Temperature Epoxy Adhesive

3521

Overview

3521 Low Temperature Epoxy Adhesive

 is a high-performance adhesive specifically developed for electronic components, particularly suitable for precision assembly of memory cards, CCD/CMOS sensors, and fingerprint recognition modules. Its low viscosity and fast-curing capability make it ideal for applications requiring high reliability.

Features

  • Color: White
  • Viscosity: 8–20 mPa·s
  • Density: 1.33 g/cm³
  • Recommended Curing Condition: 5 minutes @ 80°C
  • Glass Transition Temperature (Tg): Pre-cure 51°C
  • Shear Strength: 18 MPa
  • Storage Conditions: -25 to -15°C

Product Overview

Model Color Viscosity (mPa·s) Density (g/cm³) Recommended Curing Glass Transition Temp (Tg °C) CTE (K⁻¹) Shear Strength (MPa) Storage Condition
3190 Black 27750 1.3 1h@100℃ 135 39 -25~15℃
3510 Black 7000–27000 1.6 20min@80℃ 45 Before Tg: 40×10⁻⁶
After Tg: 130×10⁻⁶
21 -25~15℃
3520 Black 10000–20000 1.45 5–10min@80℃ 35 Before Tg: 55×10⁻⁶
After Tg: 162×10⁻⁶
≥13 -25~15℃
3521 White 8–20 1.33 5min@80℃ 51 18 -25~15℃

Features

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Specifications

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