3520 Low Temperature Epoxy Adhesive

3520

Overview

3520 Low Temperature Epoxy Adhesive

  is a high-performance adhesive formulated for electronic components, particularly well-suited for precision assembly such as memory cards, CCD/CMOS sensors, and fingerprint recognition modules. With medium viscosity, excellent adhesion, and low-temperature heat curing, it delivers reliable performance in high-reliability applications.

Features

  • Color: Black
  • Viscosity: 10,000–20,000 mPa·s
  • Density: 1.45 g/cm³
  • Recommended Curing Condition: 5–10 minutes @ 80°C
  • Glass Transition Temperature (Tg): Pre-cure 35°C
  • Coefficient of Thermal Expansion (CTE): Pre-cure 55×10⁻⁶ / Post-cure 162×10⁻⁶
  • Shear Strength: ≥13 MPa
  • Storage Conditions: -25 to -15°C

Product Overview

Model Color Viscosity (mPa·s) Density (g/cm³) Recommended Curing Glass Transition Temp (Tg °C) CTE (K⁻¹) Shear Strength (MPa) Storage Condition
3190 Black 27750 1.3 1h@100℃ 135 39 -25~15℃
3510 Black 7000–27000 1.6 20min@80℃ 45 Before Tg: 40×10⁻⁶
After Tg: 130×10⁻⁶
21 -25~15℃
3520 Black 10000–20000 1.45 5–10min@80℃ 35 Before Tg: 55×10⁻⁶
After Tg: 162×10⁻⁶
≥13 -25~15℃
3521 White 8–20 1.33 5min@80℃ 51 18 -25~15℃

Features

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Specifications

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