Low pressure molding Hot Melt Adhesive is a one-component thermoplastic polyamide resin, which is designed to meet the requirements of low pressure molding. This product is non-corrosive and odorless. It provide impressive device protections against temperature, vibration, impact, moisture, chemicals and mechanical stress. Its flammability rating meets UL94 V-0, RoHS, REACH, Halogen free standard.
Color:8807(Black)/8807A(Amber)
Package:20kg/Bag
Melting Temperature:180~220℃
Viscosity:@210°C=4000(mPa·s)
8870/8870A low pressure molding materials,are a single-material solution that delivers a simple,High-performance thermoplastic polyamide with moderate strength and hardness and good adhesion for in-cabin, connectors and underhood applications.
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